Thin Film Properties
PECVD
Film Properties |
Insulating |
Diffusion
Barrier |
Wet
Etch BOE |
Plasma
Etch |
Bulk
Stress |
Scratch
Protection |
Hydrogen
Inclusion |
Thermal
Stability |
PECVD Silicon Nitride |
Good |
Very
Good |
Very
Slow |
Moderate |
Moderately
Compressive |
Very
Good |
Moderate |
Good |
PECVD Oxide |
Very
Good |
Moderate |
Fast |
Moderate |
Mildly
Compressive |
Good |
Moderate |
Good |
PECVD Oxynitride 50X |
Variable |
Variable |
Variable |
Moderate |
Variable |
Good |
Moderate |
Good |
PECVD Oxynitride 90X |
Variable |
Variable |
Variable |
Moderate |
Variable |
Good |
Moderate |
Good |
LPCVD
Film Properties |
Insulating |
Diffusion
Barrier |
Wet
Etch BOE |
Plasma
Etch |
Bulk
Stress |
Scratch
Protection |
Hydrogen
Inclusion |
Thermal
Stability |
LPCVD Silicon Nitride |
Very
Good |
Very
Good |
Very
Slow |
Moderate |
Very
Tensile |
Very
Good |
Low |
Very
Good |
LPCVD Low Stress Nitride |
Very
Good |
Very
Good |
Very
Slow |
Moderate |
Variable |
Very
Good |
Low |
Very
Good |
Polysilicon |
Moderate
Conductor |
-- |
Very
Slow |
-- |
Compressive |
-- |
Low |
Very
Good |
Amorphous Silicon |
Moderate
Conductor |
-- |
Very
Slow |
-- |
Compressive |
-- |
Low |
Good |
Thermal Oxide |
Very
Good |
Moderate |
Fast |
Moderate |
Compressive |
Good |
Low |
Very
Good |